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TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
D Output Current of Up to 800 mA D Operates Down to 1.1-V Dropout D Specified Dropout Voltage at Multiple
Current Levels
KCS (TO-220) PACKAGE (TOP VIEW)
D 0.2% Line Regulation Maximum D 0.5% Load Regulation Maximum
KTP (PowerFLEXE) PACKAGE (TOP VIEW)
OUTPUT
INPUT OUTPUT GND
OUTPUT
INPUT OUTPUT GND
KTT (TO-263) PACKAGE (TOP VIEW)
DCY (SOT-223) PACKAGE (TOP VIEW)
OUTPUT
OUTPUT GND
GND
description/ordering information
The TLV1112 is a low-dropout voltage regulator, designed to provide up to 800 mA of output current at 1.2 V (typ). All internal circuitry is designed to operate down to 1.1-V input-to-output differential. Dropout voltage is specified at a maximum of 1.3 V at 800 mA, decreasing at lower load currents. ORDERING INFORMATION
TJ VOTYP (V) PACKAGE PowerFLEXt (KTP) SOT-223 (DCY) -40C to 125C 1.2 V TO-220 (KCS) TO-263 (KTT) PowerFLEX (KTP) SOT-223 (DCY) 0C to 125C 1.2 V TO-220 (KCS) TO-263 (KTT) Reel of 2000 Tube of 80 Reel of 2500 Tube of 50 Tube of 50 Reel of 1000 Reel of 2000 Tube of 80 Reel of 2500 Tube of 50 Tube of 50 ORDERABLE PART NUMBER TLV1112IKTPR TLV1112IDCY TLV1112IDCYR TLV1112IKCS TLV1112IKTT TLV1112IKTTR TLV1112CKTPR TLV1112CDCY TLV1112CDCYR TLV1112CKCS TLV1112CKTT TOP-SIDE MARKING
Reel of 1000 TLV1112CKTTR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerFLEX is a trademark of Texas Instruments.
PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice.
Copyright 2005, Texas Instruments Incorporated
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PRODUCT PREVIEW
OUTPUT
OUTPUT
INPUT
INPUT
TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
description/ordering information (continued)
The low-profile surface-mount KTP package allows the device to be used in applications where space is limited. The TLV1112 requires a minimum of 10 mF of output capacitance for stability. Output capacitors of this size or larger normally are included in most regulator designs. Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent current of the TLV1112 flows into the load, increasing efficiency. The TLV1112C is characterized for operation over the virtual junction temperature range of 0C to 125C. The TLV1112I is characterized for operation over the virtual junction temperature range of - 40C to 125C.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Continuous input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 V Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PRODUCT PREVIEW
package thermal data (see Note 1)
PACKAGE PowerFLEXt/TO-252 (KTP) SOT (DCY) TO-220 (KCS) TO-263 (KTT) BOARD High K, JESD 51-5 High K, JESD 51-7 High K, JESD 51-5 High K, JESD 51-5 3C/W TBD JP 1.4C/W JC 19C/W 4C/W 17C/W JA 28C/W 53C/W 19C/W TBD
NOTE 1: Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, JP is defined as the thermal resistance between the die junction and the bottom of the exposed pad.
recommended operating conditions
MIN VIN IOUT TJ Input voltage Output current TLV1112I Operating virtual junction temperature range TLV1112C -40 0 2.7 MAX 15 800 125 125 UNIT V mA C
2
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TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
electrical characteristics, TJ = 0C to 125C, all typical values are at TJ = 25C (unless otherwise noted)
PARAMETER Output voltage, VOUT Line regulation Load regulation TEST CONDITIONS VIN - VOUT = 2 V, IOUT = 10 mA, TJ = 25C 10 mA IOUT 800 mA, 1.4 V VIN - VOUT 10 V IOUT = 10 mA, 1.5 VIN - VOUT 13.8 V 10 mA IOUT 800 mA, VIN - VOUT = 3 V IOUT = 100 mA IOUT = 500 mA IOUT = 800 mA VIN - VOUT = 5 V, TJ = 25C VIN 15 V 30 ms pulse, TA = 25C VIN - VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz VIN = 15 V TJ = 0C to 125C 1000 hrs, No load, TA = 125C 60 0.8 TLV1112C MIN 1.17 1.14 TYP 1.2 1.2 0.035 0.1 1.1 1.15 1.2 1.2 5 0.01 75 1.7 0.5 0.3 5 MAX 1.23 1.26 0.2 0.5 1.2 1.25 1.3 1.5 10 0.1 A mA %/W dB mA % % V V % % UNIT
Dropout voltage (see Note 4) Current limit Quiescent current Thermal regulation Ripple rejection Minimum load current Temperature stability Long-term stability
Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Current limit test specified under recommended operating conditions NOTE 2: Dropout is defined as the input-to-output differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V.
electrical characteristics, TJ = -40C to 125C, all typical values are at TJ = 25C (unless otherwise noted)
PARAMETER Output voltage, VOUT Line regulation Load regulation TEST CONDITIONS VIN - VOUT = 2 V, IOUT = 10 mA, TJ = 25C 10 mA IOUT 800 mA, 1.4 V VIN - VOUT 10 V IOUT = 10 mA, 1.5 VIN - VOUT 13.8 V 10 mA IOUT 800 mA, VIN - VOUT = 3 V IOUT = 100 mA IOUT = 500 mA IOUT = 800 mA VIN - VOUT = 5 V, TJ = 25C VIN 15 V 30 ms pulse, TA = 25C VIN - VOUT = 3 V, Vripple = 1 Vpp, f = 120 Hz VIN = 15 V TJ = -40C to 125C 1000 hrs, No load, TA = 125C 60 0.8 TLV1112I MIN 1.17 1.14 TYP 1.2 1.2 0.035 0.2 1.1 1.15 1.2 1.2 5 0.01 75 1.7 0.5 0.3 5 MAX 1.23 1.26 0.3 0.5 1.3 1.35 1.4 1.5 15 0.1 A mA %/W dB mA % % V V % % UNIT
Dropout voltage (see Note 4) Current limit Quiescent current Thermal regulation Ripple rejection Minimum load current Temperature stability Long-term stability
Output noise voltage (% of VOUT) f = 10 Hz to 100 kHz 0.003 % All characteristics are measured with a 10-F capacitor across the input and a 10-F capacitor across the output. Pulse-testing techniques are used to maintain the junction temperature as close to the ambient temperature as possible. Current limit test specified under recommended operating conditions NOTE 4: Dropout is defined as the input-to-output differential at which VOUT drops 100 mV below the value of VOUT, measured at VIN = VOUT(nom) + 1.5 V.
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PRODUCT PREVIEW
TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
TYPICAL CHARACTERISTICS
Figure 1. Short-Circuit Current vs (VI - VO)
Figure 2. Load Regulation vs Temperature
PRODUCT PREVIEW
Figure 3. Ripple Rejection vs Frequency
Figure 4. Ripple Rejection vs Current
Figure 5. Temperature Stability
Figure 6. GND Pin Current vs Temperature
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TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
TYPICAL CHARACTERISTICS
Figure 7. Load-Transient Response
Figure 8. Line-Transient Response
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PRODUCT PREVIEW
TLV1112 1.2 V, 0.8 A LOW DROPOUT VOLTAGE REGULATOR
SLVS562B - DECEMBER 2004 - REVISED APRIL 2005
APPLICATION INFORMATION
1N4002 (See Note C)
TLV1112 VI 10 F (see Note B) INPUT OUTPUT GND 100 F (see Note A) VO
PRODUCT PREVIEW
NOTES: A. Output capacitor selection is critical for regulator stability. The recommended minimum is 10-F tantalum or 50-F aluminum electrolytic, with either one having an ESR between the range of 0.3 to 22 . Larger COUT values benefit the regulator by improving transient response and loop stability. B. CIN is recommended if TLV1112 is not located near the power-supply filter. C. An external diode is recommended to protect the regulator if the input instantaneously is shorted to GND.
Figure 9. Typical Application Circuit
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Oct-2007
PACKAGING INFORMATION
Orderable Device TLV1112IDCY TLV1112IDCYR TLV1112IKCS TLV1112IKTPR TLV1112IKTT TLV1112IKTTR
(1)
Status (1) PREVIEW PREVIEW PREVIEW PREVIEW PREVIEW PREVIEW
Package Type SOT-223 SOT-223 TO-220 PFM DDPAK/ TO-263 DDPAK/ TO-263
Package Drawing DCY DCY KCS KTP KTT KTT
Pins Package Eco Plan (2) Qty 4 4 3 2 3 3 80 2500 50 3000 50 500 TBD TBD TBD TBD TBD TBD
Lead/Ball Finish Call TI Call TI Call TI Call TI Call TI Call TI
MSL Peak Temp (3) Call TI Call TI Call TI Call TI Call TI Call TI
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS094A - APRIL 2001 - REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264) 6,30 (0.248) 3,10 (0.122) 2,90 (0.114) 0,10 (0.004) M
4
7,30 (0.287) 6,70 (0.264)
3,70 (0.146) 3,30 (0.130)
Gauge Plane 1 2,30 (0.091) 4,60 (0.181) 2 3 0,84 (0.033) 0,66 (0.026) 0,10 (0.004) M 0-10 0,25 (0.010)
0,75 (0.030) MIN
1,80 (0.071) MAX
1,70 (0.067) 1,50 (0.059) 0,35 (0.014) 0,23 (0.009) Seating Plane
0,10 (0.0040) 0,02 (0.0008)
0,08 (0.003)
4202506/B 06/2002 NOTES: A. B. C. D. All linear dimensions are in millimeters (inches). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. Falls within JEDEC TO-261 Variation AA.
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MECHANICAL DATA
MPSF001F - JANUARY 1996 - REVISED JANUARY 2002
KTP (R-PSFM-G2)
PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE
0.243 (6,17) 0.233 (5,91) 0.228 (5,79) 0.218 (5,54) 0.130 (3,30) NOM
0.080 (2,03) 0.070 (1,78) 0.050 (1,27) 0.040 (1,02) 0.010 (0,25) NOM
0.215 (5,46) NOM
0.247 (6,27) 0.237 (6,02)
0.287 (7,29) 0.277 (7,03)
Thermal Tab (See Note C)
0.381 (9,68) 0.371 (9,42) 0.100 (2,54) 0.090 (2,29)
0.032 (0,81) MAX Seating Plane 0.004 (0,10) 0.031 (0,79) 0.025 (0,63) 0.010 (0,25) M 0.005 (0,13) 0.001 (0,02)
0.090 (2,29)
0.180 (4,57)
0.010 (0,25) NOM Gage Plane
0.047 (1,19) 0.037 (0,94)
0.010 (0,25) 2- 6
4073388/M 01/02 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Falls within JEDEC TO-252 variation AC.
PowerFLEX is a trademark of Texas Instruments.
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IMPORTANT NOTICE
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